Reliable Quality, offering AOI, Visual, X-ray and Testing Facilities
Accredited to ISO 9001:2015

We are measured through customers success, quality product should be a given. Our environment fosters the process of continual improvement though training and documenting detail to continually build on the bedrock of our knowledge. Cambertronics staff are trained to IPC 610 Standard by in-house, IPC Certified Trainers, creating an expansive information portal; this goes beyond the pale of IPC standards, enabling the provision of tailored inspection and test services to meet any customer requirements.

Our equipment, like our knowledge is in a constant state of flux. Basic equipment such as AOI (Automated Optical Inspection), Visual and Test Equipment is regularly assessed and updated to stay aligned with leading technologies, whilst allowing continual improvements to flow through staff and the facilities provided.   

Examples of our processes can include:

Automated Optical Inspection (AOI)

Automated Optical Inspection (AOI) equipment is used for Surface Mount Technologies (SMT) prior to further assembly processes such as Through Hole Technology (THT). AOI equipment facilitates processes that learn, duplicate and automate removing human error and fatigue elements:

• Component type, alignment, positional accuracy and polarity checks.
  Solder inspection, validation and quality.
• Collation of defects via photographic evidence, assisting continuous improvement processes.
• Date, batch and operator.

Assisted Visual Inspection

• Where AOI does not allow us to perform detailed inspection, we have a range of high definition (HD) cameras that allow visual inspection to be carried out to the highest of standards.
• Other specialist equipment includes an Ersa Scope for inspection of BGA, QFN & LGA devices.

 X-ray Inspection

Our on-site X-ray technology enables Cambertronics to deliver detailed 2D and 3D visualisations, allowing us to detect hidden defects that are not visible through traditional optical inspection methods. As a non-destructive testing technique, X-ray inspection provides early identification of manufacturing process issues and supports robust quality assurance. With the increasing complexity and density of modern electronics, this advanced inspection capability is more essential than ever. Our X-ray inspection services include:

• Comprehensive BGA, QFN, bottom-only-termination component inspection.
• Solder joint analysis (including Head-on-Pillow, voiding, shorts). 
• Plated through-hole quality verification.  
• 2D X-ray imaging including oblique viewing inspection.
• High resolution 3D X-ray imaging of large objects (such as PCBs) utilising Computed Tomography (CT).
• X-ray imaging of electro-mechanical assemblies requiring non-destructive analysis. 

  Automated Functional Test

Test programmes and fixtures can be collated and designed by our own staff for customer approval, or supplied directly by the customer. High end assemblies follow functional tests such as JTAG (Joint Test Action Group) to allow Boundary Scans of customer products. These are some of the methods we employ to test and guarantee designs to verify active circuity, mixed signal and RF to allow customers to plug and play. Customers benefit from knowing that their product is fully validated prior to despatch.